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Engineering Insights 

Technical analyses of ultrasonic wire bonding, power electronics, and microelectronic interconnect technology. The focus is on relevant technical relationships, research results, and their practical significance for development and production.

EI_006

EI_006

Can the Ultrasonic Current Signature Reveal Bond Quality?

What the generator current during bond formation can reveal about attached area and thermal-cycling reliability.

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EI_005

EI_005

Loop Forming: How Reverse Movement Influences Heavy-Wire Bond Lifetime

How reverse movement during loop forming pre-deforms the heel – and why high reverse values can reduce fatigue lifetime.

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EI_004

EI_004

Where Wire Bond Contamination Really Matters

Wire, bond pad, or EMC? How chlorine and sulfur contamination affect the reliability of Au-Al and Cu-Al wire bonds differently.

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EI_003

EI_003

Why Do SiC Power Modules Need New Packaging Technologies?

Why SiC power modules need new packaging technologies – and why package design increasingly determines electrical and thermal performance.

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EI_002

EI_002

More Wires or Larger Wire Diameter?

How aluminium bond-wire diameter and wire count influence power-cycling reliability – and why 4 × 15 mil outperformed 3 × 20 mil in the investigated test.

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EI_001

EI_001

Is There a Perfect Ribbon-Bond Design?

How ribbon thickness and loop height influence temperature and equivalent plastic strain – and why optimization leads to a technical trade-off.

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