MPP Heavy | Large Wire Wedges
for Power Electronics

MPP Heavy Wire Wedges (also known as Large Wire Wedges, Heavy-Wire Bonding Wedges or Heavy Wire Bonding Tools) have been developed for demanding applications in power electronics.

They enable reliable wire bonding processes for aluminum wire, copper wire and ribbon bonds in power modules, automotive systems and industrial hybrid applications.

Heavy Wire Wedges for Power Modules and Power Electronics

For modern power electronics applications, maximum process reliability, long tool life and reproducible bond connections are essential. These bonding tools are particularly suitable for:

Power semiconductors
Automotive power modules
SiC and IGBT modules
E-mobility applications
Industrial electronics
Hybrid and power packages
Sensor and power modules

Supported applications include wire diameters from 4–20 mil as well as aluminum wire, copper wire and ribbon bonding processes. This makes them an ideal solution for demanding applications in power electronics and e-mobility.

Technological Advantages of MPP Heavy Wire Wedges

Advanced Coating Technology & Optimized Tip Geometries

Optimized tip geometries combined with specialized coating technologies
Reduced aluminum build-up for outstanding low build-up performance
High process stability and reproducible bond results
Reduced cleaning effort, longer tool life and improved MTBA (Mean Time Between Assist)

Precision Manufacturing through EDM Technology

Precision manufacturing using EDM technology (Electrical Discharge Machining)
Consistent tool quality
High dimensional accuracy and contour precision
Maximum repeatability between production batches

Your Benefits

Increased Productivity and Equipment Availability

Reduced build-up effects and operator interventions
Higher bonder uptime
Improved MTBA (Mean Time Between Assist)

Reduced Operating Costs

Longer tool life
Fewer tool changes and reduced maintenance effort
Lower production costs
Improved Total Cost of Ownership (TCO)

Easy Integration into Existing
Processes

Drop-in replacement for existing bonding tools
No process adjustments required
Reduced qualification effort

Higher Process Reliability

Stable bond quality
High repeatability
Support for automotive and quality requirements

Compatible with Leading Wire Bonders

MPP Heavy Wire Wedges are available as a direct replacement for the industry's leading wire bonding systems.

Compatible with:

Kulicke & Soffa (K&S)
ASMPT
Hesse
F&K Delvotec
F&S Bondtec
Cho-Onpa

Available for:

Automatic wire bonders
Semi-automatic wire bonders
Manual wire bonders

Custom Solutions and Engineering Support

Customized Configurations

Custom wedge geometries, designs and coatings
DMC, QR code marking and serial numbers (S/N)
Manufacturing based on drawings, samples or customer specifications (Print-to-Spec / Sample-to-Spec)
Reverse engineering as well as replication and optimization of existing bonding tools

Why Choose MPP Heavy Wire Wedges?

Key Benefits at a Glance

✔ Complete heavy-wire wedge range and ribbon bonding solutions

✔ Optimized tip geometries and specialized coatings for reduced build-up effects

✔ Precision manufacturing using EDM technology

✔ High process reliability and repeatability

✔ Higher MTBA, reduced maintenance effort and fewer downtime events

✔ Reduced Total Cost of Ownership (TCO)

✔ Drop-in replacement – no process adjustments required

✔ Compatible with leading bonding systems

✔ Custom markings for enhanced traceability (QR code, S/N)

✔ Engineering support and customized solutions

Request a Consultation

TA.TEC supports you in selecting the optimal MPP Heavy Wire Wedge and optimizing your heavy-wire and ribbon wire bonding processes.

Let us discuss your current application and challenges without obligation – from build-up effects and tool life to process stability, MTBA and cost-reduction projects.

Request a Consultation