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MPP Heavy | Large Wire Wedges
for Power Electronics

The MPP Heavy | Large Wire Wedges are designed for applications in power semiconductors, automotive power modules, and industrial power hybrids. They meet the highest requirements in power electronics, electric mobility, and industrial electronics, reliably processing large wire diameters from 4–20 mil and ribbon bonds.

Benefits of Our Heavy-Wire Wedges

Advanced Coating & EDM Technology

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  • Special coating solutions: special tip designs and coating for superior "low build-up" performance

  • High-dimensional repeatability: precision through EDM technology

  • Cost-Reduction Projects: for better uptime and improved MTBA - Mean Time between Assist

Universal compatibility

  • Kompatibilität:  mit allen bekannten Bonder-Herstellern - KNS, Cho-Onpa, ASM, F&K, Hesse

  • Komplette Heavy Wire Range: 4mil bis 20mil & Ribbon Applications abgedeckt

  • Eins-zu-eins Ersatz: Wedges für automatische, semi-automatische und manuelle Systeme

End-to-End Engineering Support

  • Expert support: from wedge selection to validation

  • Comprehensive qualification: process reliability and solutions from concept to series production

  • Individual marking: Special marking options (S/N, QR Code) and customer-specific designs

Decision-making basis

Proven performance | Universal compatibility | Engineering excellence | Cost optimization

MPP Heavy Wire Wedge – durable bonding tool for heavy wire applications in power electronics
MPP Heavy Wire Wedge – durable bonding tool for heavy wire applications in power electronics
MPP Heavy Wire Wedge – durable bonding tool for heavy wire applications in power electronics
MPP Heavy Wire Wedge – durable bonding tool for heavy wire applications in power electronics
MPP Heavy Wire Wedge – durable bonding tool for heavy wire applications in power electronics

Still questions?

We offer you non-binding expert advice for your application.

for Germany, Austria & Switzerland

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