TA.TEC Consulting
iBOND5000Series
Table Top- & Manual Wire Bonder
The iBOND5000Series from Micro Point Pro (MPP) is based on the proven Kulicke & Soffa KS4500 Series, which was recognized as one of the world's leading manual wire bonders for many years.
Following the acquisition of the Kulicke & Soffa wire bonder product line in 2016, MPP continuously enhanced the platform and developed the modern iBOND5000Series. The systems combine proven bonding technology with a modern user interface, high process stability, and flexible applications for research, development, and production.
As a modern table top wire bonder and manual wire bonder, the iBOND5000Series is suitable for ball-wedge and wedge-wedge bonding applications in microelectronics, semiconductor manufacturing, optoelectronics, and power electronics.
Wire Bonding System for R&D and Production
The iBOND5000Series has been designed for maximum ease of use and efficient workflows.
Modern Software and Connectivity
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7" TFT touchscreen with intuitive user interface
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Windows CE-based control software
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Factory pre-configured bonding profiles
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Storage and management of individual bonding parameters
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USB ports for mouse, keyboard, and data backup
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Fast setup and simple operation
Overview of iBOND5000 Models
iBOND5000BALL
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Negative EFO - Technology for consistent ball sizes
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Multi-bonding modes: Ball Bonding, Bumping, Coining, Security Wire & TAB
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Missing ball detection with auto-stop function
iBOND5000DUAL
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Seamless transition between ball and wedge in under 10 minutes
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2-in-1 performance for maximum flexibility
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Ideal for R&D and mixed production requirements
iBOND5000WEDGE
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for Al, Au, Ag and Cu wires
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Ribbon ( Au up to 25 x 250 μm)
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Versatile applications: from optoelectronics to high-power devices
Precision and Control
The iBOND5000Series has been developed to ensure stable and repeatable bonding processes.
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Semi-automated Y-axis for repeatable results
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Closed-loop servo motion for the Z-axis with manual fine adjustment
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Phase Locked Loop (PLL) ultrasonic generator up to 3W at 60kHz
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Temperature control for stable process conditions
Applications in Electronics Manufacturing
The iBOND5000Series supports a wide range of applications in research, development, and production.
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Bonding area up to 6" x 6"
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Z-travel up to 125mm
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Precision microscope with various illumination options
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Suitable for semiconductor manufacturing and advanced packaging
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Ideal for prototyping, laboratories, and low-volume production
Advantages of the iBOND5000Series
In addition to its technical performance, the iBOND5000Series offers excellent cost efficiency and long-term investment security.
Cost Efficiency and Investment Security
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Complete solution including machine, bond wedges, and technical support
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Trade-in options available
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Fast online and on-site service
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Minimized downtime through technical support
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Ergonomic design for comfortable operation
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Long-term availability of spare parts and accessories
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Proven manual wire bonder platform for research, development, and low-volume manufacturing
Consultation and Product Information
TA.TEC supports you in selecting the right iBOND5000 system for your application.
The Right Solution for Your Application
Whether fine wire, heavy wire, ball bonding, wedge bonding, or specialized research applications – we provide non-binding consultation to help you identify the optimal configuration.
Contact us for further information or a personal product consultation.
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