TA.TEC Consulting
The iBOND5000SERIES is based on the proven Kulicke & Soffa KS4500 Series – the market leader for manual wire bonders for nearly a decade. After acquiring the Kulicke & Soffa wire bonder product line in 2016, MPP further developed the KS4500 Series into the modern iBOND5000SERIES .
Modern UI & standard connectivity
-
Intuitive operation: 7" TFT touchscreen (600x800) with Windows CE-based software
-
Intelligent profiles: Factory preconfigured profiles for quick start
-
Flexibility: Saving and loading individual bond parameters
-
USB: for (mouse, keyboard and storage)
iBOND5000 models at a glance
iBOND5000BALL
-
Negative EFO - Technology for consistent ball sizes
-
Multi-bonding modes: Ball Bonding, Bumping, Coining, Security Wire & TAB
-
Missing ball detection with auto-stop function
iBOND5000DUAL
-
Seamless transition between ball and wedge in under 10 minutes
-
2-in-1 performance for maximum flexibility
-
Ideal for R&D and mixed production requirements
iBOND5000WEDGE
-
for Al, Au, Ag and Cu wires
-
Ribbon ( Au up to 25 x 250 μm)
-
Versatile applications: from optoelectronics to high-power devices
Precision and control
-
Semi-automated Y-axis for reproducible results
-
Closed-loop servo motion for Z-axis with manual fine adjustment
-
Phase Locked Loop (PLL) US generator up to 3W at 60kHz
-
Temperature control for process-stable conditions
Application flexibility
Bonding area: up to 6" x 6" for large substrates
Z-Travel: up to 12.5cm for different heights
Precision microscope with various illumination options
Economic Performance - Benefits
-
Complete solution: machine, tools, application development, service
-
Trade-in and rental options available
-
Online and rapid on-site technical support for minimal downtime
-
Ergonomic design for fatigue-free working
iBOND5000SERIE
Wire Bonders for Flexible Applications
Decision-making basis
Proven technology | Modular flexibility | Comprehensive support | Investment security
 |  |  |
|---|