Waffle Tip Bonding Tools
Specialized Solutions for High Bond Quality

Micro Point Pro (MPP) developed the Waffle Tip Bonding Tools specifically for demanding ribbon and lead-to-lead bonding applications. They enable precise, reliable connections with optimized heat dissipation and uniform pressure distribution.

Improved Heat Dissipation: The waffle design provides superior cooling during the bonding process.
Reduced Damage Through Uniform Pressure Distribution: Even pressure distribution protects sensitive materials from stress or cracks.
Longer Tool Life: Uniform wear extends tool lifetime and reduces replacement costs.
Versatile Use: Suitable for different wire diameters, ribbons, and materials.
Superior Bond Quality: Consistent performance ensures stable and reliable electrical connections.

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for Germany, Austria & Switzerland