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Technology Consulting for Ultrasonic Wire Bonding & Laser Micro Welding in Series Production

Increase process stability. Reduce scrap. Secure series quality.

Process Expertise in Wire Bonding and Micro Welding

Bond Process Design & Optimization

We support you in the systematic design of robust and reproducible bonding processes - from defining suitable process parameters and stable process windows to validated implementation in the production environment.

Using Design of Experiments (DoE), we analyze parameter interactions in a structured manner and identify stable operating windows. Existing bonding processes are stabilized and optimized to ensure consistent series quality, reduce scrap rates, and measurably improve process capability.

Partner Solution

Exclusive Partner of Micro Point Pro (MPP) in Germany, Austria and Switzerland (DACH Region)

Wedges for fine and heavy wire, iBOND5000 wire bonders, pick-and-place systems, precision dispensers, and customized tooling solutions for stable manufacturing processes.

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Process Challenges? Let’s Talk.

In an initial consultation, we analyze your current situation and identify concrete optimization potential for your production.

Structured. Practical. Solution-oriented.

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