TA.TEC Consulting
Technology Insights
Expertise in ultrasonic wire bonding & laser micro welding
Practical Expertise for Germany, Austria and Switzerland
Increase your production efficiency through targeted process optimization in ultrasonic wire bonding and laser micro welding.
Our technology experts combine deep know-how with proven solutions to meet your electronic manufacturing needs. From fine-pitch bonding to heavy wire applications, we deliver practical expertise that improves yield and reliability.
Technology-Highlights:
Proven Methods for Maximum Bond Quality
Benefit from specialized solutions tailored to your applications in semiconductor, power electronics, and precision manufacturing.
Bond Process Optimization
From fine-wire applications to heavy-wire power connections – we develop customized process parameters for efficient and stable bonding operations.
Precision Tools
Micro Point Pro (MPP) standard and custom wedges ensure consistent results with optimized tip designs and coatings that prevent contamination and extend tool life.
Quality Assurance
Achieve reproducible bond results through systematic process validation and continuous quality control.
From Training to Implementation – Our Service Offering
TA.TEC Consulting supports you along the entire process chain with:
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Technology training for production teams
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Best practices from industrial applications
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High-quality solutions from leading technology partners
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Consulting for ultrasonic wire bonding and laser micro welding
Explore Our Specialized Technology Fields
Laser-Laser Micro Welding
Discover how our expertise enhances your production quality and process reliability.