TA.TEC Consulting
FUNDAMENTALS
BONDING TECHNOLOGIES
ULTRASONIC WIRE BONDING
PRECISION JOINING TECHNOLOGY – EXPERTISE FOR GERMANY, AUSTRIA AND SWITZERLAND
Ultrasonic wire bonding is a proven method for creating intermetallic connections between wire and substrate - either at room temperature or with mild thermal assistance (thermosonic bonding).
This technology is widely used in power semiconductors, sensors, and RF modules.
Wire Sizes & Types
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Fine-/ Small-Wire: ≤3 mil (≤75 µm)
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Heavy-/Large-Wire: 4–24 mil (125–600 µm)
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Ribbon Wire: rectangular cross-section for power applications
Bonding-Technology
Wedge-Wedge Bonding
Room-temperature ultrasonic bonding for aluminum wires on Al or Au metallizations.
Gold wires can be processed using specialized cross-groove wedges or via thermosonic bonding with substrate heating.
Applications: Power modules (IGBT, diodes), hybrid circuits, sensors, HF devices.
Advantages: Minimal thermal load, high bond strength, large wire cross-sections for current capacity.
Limitation: Directional tool orientation restricts layout flexibility.
Ball-Wedge-Bonding
Thermosonic process combines the advantages of thermocompression and wedge bonding by combining ultrasound, bonding force and moderate substrate temperature (120–220 °C).
First Bond: Free Air Ball via positive/negative EFO flame;
second bond: Crescent/Fishtail with 360° directional freedom.
Used in ICs, memory modules (DRAM, Flash), optoelectronics (LEDs, laser diodes), MEMS and high-density interconnects.
Advantages: Directional independence, short bonding times, established high-volume process.
Disadvantage: Heated handpieces require controlled thermal management to prevent unwanted heating of adjacent machine components. At the same time, a uniform and constant temperature distribution across the components must be ensured.
Bond Process and Quality Factors
The ultrasonic bond process consists of four phases:
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Contact formation between wire and pad
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Surface activation via ultrasonic friction
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Plastic deformation of the wire
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Diffusion and intermetallic formation
Key parameters: ultrasonic power, bond force, bonding time, and material selection.
Even minimal deviations can impact bond strength, long-term reliability, and consistency.
Benefits of Ultrasonic & Thermosonic Bonding
Room temperature bonding reduces thermal stress
Thermosonic bonding: short bonding times, full directional freedom
High process stability, even in large-volume production lines
Data recording enables bonding process optimization
Suitable for fine and heavy wire applications
Precise, reliable connection technology, minimizes errors
Practice-Oriented Solutions & Expert Support
Enhance your expertise through wire bonding training programs and explore MPP iBOND 5000 manual Table top manual wire bonders for R&D and small-batch production.
→ Explore: Training | iBOND 5000 Series | Fine-Wire Wedges | Heavy-Wire Wedges
PROCESS OPTIMIZATION
BONDQUALITY KEY FACTORS FOR RELIABILITY
Bond quality plays a crucial role in ensuring the reliability of electronic assemblies. Achieving a stable bonding process requires careful balancing of all process parameters – including ultrasonic power, bonding force, temperature (thermosonic bonding), and bonding duration. Even slight variations can significantly impact both the mechanical and electrical integrity as well as the longevity of the connection.
Professional bond process optimization aims to establish robust process windows that deliver consistent stability and reproducibility. Our wire bond optimization focuses on maintaining exceptional bond quality across both fine-wire and heavy-wire applications.
Factors influencing bond quality
Several physical and material-technical factors determine the quality of a bond:
Material properties of wire and substrate (e.g. aluminum, copper, gold)
Surface quality and cleanliness of the bond pads and wire
Mechanical stability (wedge, capillary, clamping)
Temperature management in the thermosonic bonding process
Fine-tuning of process parameters to the respective application
Continuous process monitoring, supplemented by bond parameter analyses and statistical evaluations, enables a well-founded assessment of bond quality and process performance.
Multifactorial DoE – From process window to optimization
After determining the process window, TA.TEC Consulting offers a structured approach for multifactorial process optimization using Design of Experiments (DoE).
From test planning and test support to statistical evaluation, TA.TEC supports companies in systematically understanding process parameters and identifying interactions between ultrasonic power, force, time and temperature.
This approach enables:
Targeted process improvement based on data and facts
Reduction of process variations
Shortening development times
Long-term increase in process stability
By combining empirical knowledge, DoE methodology and practical process support, sustainable bonding process optimization is achieved – especially in demanding applications in power electronics, sensor technology and microsystem technology.
Practical support
TA.TEC Consulting offers comprehensive process support: from bonding process analysis and parameter optimization to customized training and courses. Benefit from practical expertise and precise tool solutions for your production requirements.
TRAINING & WORKSHOP
KNOW-HOW FOR RECISE &
STABLE BOND CONNECTION
A thorough understanding of bonding technology is crucial to achieving precise, stable and reproducible wire bond connections in modern electronics manufacturing.
TA.TEC Consulting offers practical wire bonding training and courses → (OEM specific).
Our training courses are aimed at specialists in electronics manufacturing, production employees, process developers, and quality assurance who want to deepen their skills in ultrasonic wire bonding and thermosonic bonding technology.
Training content – From basics to process optimization
Each training is individually tailored to the customer's experience and production requirements. Typical content includes:
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Introduction to bonding processes and technologies (ultrasonic, thermosonic and ball wedge bonding)
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Machine operation, parameterization, Pattern recognition and bond program creation
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Analysis of bond parameters and optimization of process stability
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Process window determination
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Quality assessment and failure analysis (Bond Failure Analysis)
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Practical exercises
Through the combination of theory and practice, participants gain a deep understanding of the process – from the production of intermetallic compounds to ensuring bond quality in the series process.
Benefits of TA.TEC Wire Bonding Trainings
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On-site training tailored to your machine, product, and process
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Our in-house training programs bring expertise directly to your production floor. We conduct process analysis and troubleshooting on your actual equipment, providing hands-on, on-the-job training that addresses your specific challenges.
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Our training courses build lasting expertise within your organization – making a vital contribution to quality assurance, process optimization, and cost reduction in production.
→ Discover our Wire Bonding Training & Workshop Programs
PRODUCTION SUPPORT
ASSISTANCE DIREKTLY AT YOUR MANUFACTURING FACILITY
Targeted support for stable bonding processes
Sudden bond defects without parameter changes – a familiar scenario in electronics manufacturing under production pressure. The causes are often gradual system changes: transducer aging, wear on clamping components, wedge contamination, or bonding force drift. Insufficient process windows fail to compensate for batch variations. TA.TEC Consulting identifies these critical factors directly at your production line and optimizes fine-wire and heavy-wire bonding processes together with your production team. The result: improved bond quality, reduced scrap rates, and enhanced process stability in series production.
Root cause analysis & process evaluation on-site
Our structured bond process analysis takes place directly in your production environment. Through 1-3 day production accompaniment and on-the-job training, we evaluate your team's troubleshooting methodology and procedures without production downtime. We minimize scrap, standardize failure analysis processes, and sustainably increase quality awareness – measurably through improved product quality and yield.
Long-term process reliability & efficiency gains
Beyond immediate problem-solving, we develop sustainable strategies for defect prevention. The goal: increasing first-pass yield, minimizing rework, and maintaining consistently high bond quality in both laboratory and production environments.
→ Request Production Support
COMMON ERRORS
IN THE BONDING PROCESS
Typical Sources of Error in Wire Bonding Processes
Bonding errors compromise the reliability of electronic assemblies even in stable manufacturing environments. Common causes include: incorrect bond force settings, insufficient ultrasonic energy, and wedge wear. Classic bonding defects such as wire breaks, lift-offs, incomplete metallic connections, or cratering result from the interaction of multiple process parameters.
Sustainable Process Reliability Through Knowledge Transfer
Operator competence is crucial for error prevention. TA.TEC provides hands-on wire bonding training that teaches safe handling of bonding processes, interpretation of process data, and proper assessment of bond quality metrics.
→ Bond Training & Courses | Process Optimization & Bond Quality Inquiries
PRECISION TOOLS & TECHNOLOGIES
MICRO POINT PRO (MPP) SOLUTIONS
FOR ULTRASONIC WIRE BONDING
MPP Wire Bonders – Precision for Fine/Small and Ribbon Wire Applications
As the exclusive Micro Point Pro (MPP) partner in Germany, Austria, and Switzerland, TA.TEC Consulting offers precise manual table top wire bonders from the iBOND 5000 series for fine-wire und -ribbon applications. The compact systems are ideal for research, development, and small-scale production, combining flexibility, process stability, and intuitive operation.
Over 40 customizable workholder variants enable precise deployment across diverse applications – from power electronics to sensor integration.
→ iBOND 5000 Series | Fine Wire Wedges | Heavy Wire Wedges
One-Stop Shopping for Your Bonding Systems
As a certified MPP partner, TA.TEC provides comprehensive support:
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System Selection: Application-specific configuration tailored to your needs
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Wedge Consultation: From standard to custom-made tools from the extensive MPP portfolio
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After-Sales Service: Installation, maintenance, preventive maintenance with minimal response times
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Comprehensive Portfolio: Solutions for back-end and front-end electronics manufacturing
→ Discover our Partner Solutions
WHY TA.TEC ?
YOUR PARTNER FOR PROCESS RELIABILITY AND TECHNOLOGY EXPERTISE
Collaborative, Transparent, and Manufacturer-Independent
TA.TEC Consulting stands for independent technology consulting in electronics manufacturing, with a focus on ultrasonic wire bonding and laser microwelding. As a manufacturer-independent partner, we support companies in Germany, Austria, and Switzerland in sustainably improving their manufacturing processes through data-driven analyses, practice-oriented optimizations, and training.
Our goal: Long-term process stability, reproducible bond quality, and efficient production workflows.
→ Request a no-obligation consultation now
Objective Technology Consulting for Sustainable Process Improvement
As an independent technology consultant, TA.TEC Consulting evaluates your bonding processes neutrally and based on technical facts. We analyze process parameters, machine conditions, and tool selection to identify weak points and systematically optimize process windows. Our focus is on demonstrable process improvement and quality assurance – from prototype manufacturing to series production.
The combination of experiential knowledge, data analysis, and DoE methodology (Design of Experiments) enables precise, reproducible results.
Consulting and System Integration (Micro Point Pro Product Line)
TA.TEC Consulting works in a solution-oriented manner. We provide objective support for the selection, configuration, and integration of manual benchtop wire bonders, particularly the iBOND 5000 series from Micro Point Pro (MPP) – tailored for your R&D projects and small-scale production, as well as for deploying suitable MPP standard and specialty wedges for fine wire, heavy wire, and ribbon bonding.
Our commitment:
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Tailored system recommendations, optimally aligned with your production requirements
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Hands-on training directly on your equipment
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After-sales support & service for the iBOND 5000 series in Germany, Austria, and Switzerland
Our goal is your satisfaction and success. Through compelling results, we establish the foundation for a long-term and trusting partnership.
→ iBOND 5000 Series | MPP Fine Wire Wedges | MPP Heavy Wire Wedges
Trust Through Transparency and Collaborative Partnership
We understand technology consulting as a partnership between equals.
TA.TEC supports you from initial assessment through process analysis to long-term production support.
Our customers from the semiconductor, sensor, automotive, and power electronics industries value our transparency, practical communication, and demonstrable results.
Through clear documentation, open communication, and traceable measures, we build trust – the foundation for successful, stable, and efficient manufacturing solutions.
→ Have any questions? Feel free to contact us.