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MPP Fine- | Small-Wire Wedges

Precision Bonding Tools for Microelectronics

35+ Years of Fine Wire Bonding Expertise

Micro Point Pro (MPP) is a leading manufacturer of high-precision Fine Wire Wedges for the microelectronics and semiconductor packaging industry.

Our bonding tools deliver unmatched tool-to-tool repeatability, stable bonding results, and maximum production yields across manual and automated wire bonding systems.

Product Portfolio

Standard & High-Volume Production

High-Performance Applications

Deep Access & Manual Bonding

  • 4WA Series
    Standard Fine Wire Wedges for a wide range of wire bonding applications.

  • 4WF Series
    Fine-Pitch Wedges with Vertical Side Relief (VSR) for ultra-small wire-to-wire spacing.

  • 4WC Series
    Chip-on-Board (COB) bonding tools available with a wide range of proven wedge tip geometries.

  • 4WU Series
    Patented design optimized for narrow-pitch bonding below 1.7 mil.

  • 4WN Series
    Notched-tip wedges for microwave, RF, and hybrid applications with reduced wire stress.

  • 4WR Series
    Ribbon bonding wedges with rectangular feed holes for ribbon sizes from 1 × 0.25mil up to 20 × 4mil.

  • 4WV Series
    Notched wedges for manual deep-access bonding applications.

  • 4WD Series
    Deep-access wedges designed for automated wire bonders.

Why Choose MPP Fine Wire Wedges?

  • Precision Manufacturing: Strict quality control and quality assurance ensure maximum accuracy and repeatability.

  • Customer-Specific Solutions: Customized wedge designs tailored to your bonding process and application requirements.

  • Reliable Supply & Support: Short lead times, competitive pricing, and consignment options for production environments.

Key Benefits

Proven Performance | Universal Compatibility | Engineering Excellence | Cost Optimization

Looking for the Optimal Fine Wire Wedge for Your Application?

Whether for standard applications, fine-pitch bonding, COB, ribbon bonding, or deep-access applications, our experts will support you in selecting the right wedge for maximum process stability, bond quality, and cost efficiency.
 

Request a non-binding consultation today.

MPP Fine Wire Wedges – high-precision wedge bonding tools for microelectronics
MPP Fine Wire Wedges – high-precision wedge bonding tools for microelectronics
MPP Fine Wire Wedges – high-precision wedge bonding tools for microelectronics
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