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TA.TEC Consulting
MPP Fine | Small Wire Wedges
for microlectronics
35+ years of fine wire expertise
Micro Point Pro (MPP) is a leading supplier of fine-wire wedges for the microelectronics manufacturing industry.
Our tools guarantee unparalleled tool-to-tool reproducibility for stable bonding results and highest yields.
Product portfolio
Standard & High-Volume Production
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4WA Model: ideal for common standard applications.
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4WF Model: Fine-pitch applications with VSR (Vertical Side Relief), enables bonding of particularly small wire-to-wire distances.
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4WC Model: COB (Chip on Board) Applications - A variety of standardized wedge tip designs are available.
Specialized Performance Applications
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4WU Model: patented, specially developed for narrow-pitch bonding (< 1.7 mil).
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4WN Model: Notched tip for microwave and hybrid applications – minimal stress on the wire.
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4WR Model: Ribbon Applications - Rectangle hole for 1x0.25mil to 20x4mil ribbon sizes.
Deep Access & Manual Applications
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4WV Model: Notched for manual deep access applications.
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4WD Model: Deep Access for Automatons
Target applications
Consumer Electronics, Sensor Technology, Aerospace, Military & Defense, Medical Technology
Economic Performance - Benefits
Top Performance: extended service life 🡢 Low cost per bond
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Quality Tools: Strict QC & QA for high accuracy and repeatability
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Customer Qualified: Tools developed and adapted to your needs
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Excellent support: Short delivery times, attractive prices, consignment options
Decision-making basis
Proven performance | Universal compatibility | Engineering excellence | Cost optimization
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