top of page

MPP Fine Wire Wedges

Precision Bonding Tools for Microelectronics

35+ Years of Fine Wire Bonding Expertise

Micro Point Pro (MPP) is a leading manufacturer of high-precision Fine Wire Wedges for microelectronics and semiconductor packaging applications.

Our bonding tools deliver exceptional tool-to-tool repeatability, stable bond quality, and maximum production yield across manual and automated wire bonding systems.

Produkt portfolio​

Standard & High-Volume Production

High-Performance Applications

Deep Access & Manual Bonding

  • 4WA Series
    Standard Fine Wire Wedges for a wide range of wire bonding applications.

  • 4WF Series
    Fine-Pitch Wedges with Vertical Side Relief (VSR) for ultra-small wire-to-wire spacing.

  • 4WC Series
    Chip-on-Board (COB) bonding tools available with a wide range of proven wedge tip geometries.

  • 4WU Series
    Patented design optimized for narrow-pitch bonding below 1.7 mil.

  • 4WN Series
    Notched-tip wedges for microwave, RF, and hybrid applications with reduced wire stress.

  • 4WR Series
    Ribbon bonding wedges with rectangular feed holes for ribbon sizes from 1 × 0.25mil up to 20 × 4mil.

  • 4WV Series
    Notched wedges for manual deep-access bonding applications.

  • 4WD Series
    Deep-access wedges designed for automated wire bonders.

Why Choose MPP Fine Wire Wedges?

  • Precision Manufacturing: Strict quality control and quality assurance ensure maximum accuracy and repeatability.

  • Customer-Specific Solutions: Customized wedge designs tailored to your bonding process and application requirements.

  • Reliable Supply & Support: Short lead times, competitive pricing, and consignment options for production environments.

Key Benefits

Proven Performance | Universal Compatibility | Engineering Excellence | Cost Optimization

Sie suchen den optimalen Fine-Wire-Wedge für Ihre Anwendung?

Ob Standardanwendung, Fine-Pitch-Bonden, COB, Ribbon-Bonden oder Deep-Access-Applikationen – unsere Experten unterstützen Sie bei der Auswahl des passenden Wedge für maximale Prozessstabilität, Bondqualität und Wirtschaftlichkeit.

Fordern Sie jetzt eine unverbindliche Beratung an.

MPP Fine Wire Wedges – hochpräzise Wedge-Bonding-Werkzeuge für Mikroelektronik
MPP Fine Wire Wedges – hochpräzise Wedge-Bonding-Werkzeuge für Mikroelektronik
MPP Fine Wire Wedges – hochpräzise Wedge-Bonding-Werkzeuge für Mikroelektronik
bottom of page