TA.TEC Consulting
YOUR RELIABLE PARTNER
for ULTRASONIC WIRE BONDING, LASER MICRO WELDING & TECHNOLOGY CONSULTING
→ practical | efficient | sustainable
Specialized technology consulting
Our technology consulting services encompass bond process development, bond process optimization, targeted bond training, and on-site support directly in your production. With in-depth expertise in microelectronics, we provide our customers with comprehensive support for the implementation, stabilization, and continuous optimization of bond processes – tailored to the highest quality and reliability requirements.
We support you in ultrasonic wire bonding, laser micro-welding, and complex manufacturing processes. Through customized, practical solutions, we ensure sustainable production success in your front-end and back-end electronics manufacturing.
Exclusive partner of Micro Point Pro (MPP) in the DACH region
As the exclusive partner of Micro Point Pro (MPP) in Germany, Austria and Switzerland (DACH), we offer high-quality all-round solutions for wire bonding – from bonding process optimization to the selection of suitable systems and tools.
MPP is a leading supplier of manual wire bonders, bonding tools (wedges) for thin and thick wires, and high-precision tools for front-end and back-end electronics manufacturing.
MPP's products perfectly complement our tailored technology consulting and enable our customers to find practical solutions for sustainable bonding process optimization, highest manufacturing quality and process stability.